resin / vitrified / metal / electroplated bond wheel, diamond cutting wheels, blade sharpening wheel, grinding wheels for circular saw blade, resin bond double side wheel, diamond sharpener, Superhard abrasive tools, diamond grinding wheels
Brand: KO
Type: Flat grinding wheel
Material: Diamond
Diameter: 6-900mm
Line speed: 35~80m/s
Grit: 40#~W3.5 (mesh)
Application: tungsten carbide, pcd, pcbn, ceramic, cermet
Binding Agent: Resin
Grit: 40#~W3.5 (mesh)
Application: tungsten carbide, pcd, pcbn, ceramic, cermet
Binding Agent: Resin
Certification: ISO 9001:2000
MOQ: 5 pieces
We are able to provide resin bond grinding wheels according to customers’ different requirements. The diameter range is 6-900mm; the thickness range is 0.07-520mm; the grit size range is 40/50-W3.5. We can also design and make nonstandard grinding wheels according to customers’ requirements.
Features:
The resin bond products have the features of good self-sharpening, sharp cutting, high efficiency, low roughness of work piece surface, few heat generating and without burning workpiece. They are suitable for high efficiency and precision grinding of most workpieces.
Application:
Resin bond diamond products: mainly used for machining tungsten carbide, ceramic materials, magnetic materials, silicon materials, thermal spraying alloy materials and so on.
